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| hal-00726706v1
Communication dans un congrès
Finite element simulation of structural adhesive bonding under dynamic loading, constitutive model, parameters identification and validation on an industrial benchmark ACEX 2012 (6th International Conference on Advanced Computational Engineering and Experimenting), Jul 2012, Istanbul, Turkey |
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| hal-00644902v1
Chapitre d'ouvrage
Experimental analysis of the mechanical behaviour of a ductile adhesive in a bonded joint under proportional tensile-shear loads J. S. Doyle and R. C. O'Quinn. Adhesives: Types, Mechanics and Applications (on invitation only), NovaPublisher's book, Chapter 1, pp 1-45, 2011 |
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| hal-01507263v1
Communication dans un congrès
Déphaseur compact passe-tout large-bande basé sur des lignes couplées à ondes lentes en CMOS 65nm à 28GHz 20èmes Journées Nationales Microondes, May 2017, Saint-Malo, France. pp.1-2 |
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| hal-00541441v1
Direction d'ouvrage, Proceedings, Dossier
Model Driven Engineering for Distributed Real-Time Embedded Systems Hermes Science Publishing, pp.Non renseigné, 2005 |
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| inria-00555044v1
Communication dans un congrès
Trust in MDE Components: the DOMINO Experiment SD4RCES workshop in conjunction with SAFECOMP 2010, 2010, Vienna, Austria |
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| hal-02136008v1
Communication dans un congrès
Compact Analog All-Pass Phase-Shifter in 65-nm CMOS for 24/28 GHz on-Chip-and in-Package Phased-Array Antenna 23rd IEEE Workshop on Signal and Power Integrity, Jun 2019, Chambery, France |
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