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hal-02386136v1
Direction d'ouvrage, Proceedings, Dossier
SPLC '19: Proceedings of the 23rd International Systems and Software Product Line Conference - Volume A 2019 |
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Communication dans un congrès
REVaMP 2 Project: Towards Round-Trip Engineering of Software Product Lines -Approach, Intermediate Results and Challenges International Conference on Objects, Components, Models and Patterns (TOOLS 2019), Oct 2019, Innopolis, Russia |
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