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Average power handling capability of microstrip passive circuits considering metal housing and environment conditions

M. Sanchez-Soriano Yves Quéré 1 Vincent Le Saux 2 Cédric Quendo 3 S. Cadiou 4
2 MMA
LBMS - Laboratoire brestois de mécanique et des systèmes
3 Lab-STICC_UBO_MOM_DIM
Lab-STICC - Laboratoire des sciences et techniques de l'information, de la communication et de la connaissance, UBO - Université de Brest
Abstract : In this paper, the average power handling capability (APHC) of microstrip passive circuits considering the metal housing and environment conditions is investigated in detail. A systematic method is proposed for the computation of the APHC of microstrip circuits in open and enclosed metal housing configurations, typically used in microwave components. The method also yields an estimate of the maximum temperature in a microstrip circuit for a given input power. Closed-form equations accounting for external conditions, such as convection or radiation heat transfer are given to evaluate the APHC. For validation, two microstrip bandstop filters centered at 10 GHz are analyzed following the proposed model, and the results are compared with those simulated showing a good agreement. In addition, both circuits are fabricated and characterized. Thermal profile measurements are provided, confirming the predicted results. The effect of the topology layout and the electromagnetic performance on the APHC are also discussed.
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https://hal.archives-ouvertes.fr/hal-01072079
Contributeur : Nathalie Leal <>
Soumis le : mardi 7 octobre 2014 - 14:41:28
Dernière modification le : mercredi 24 juin 2020 - 16:19:23

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M. Sanchez-Soriano, Yves Quéré, Vincent Le Saux, Cédric Quendo, S. Cadiou. Average power handling capability of microstrip passive circuits considering metal housing and environment conditions. IEEE Transactions on Components, Packaging and Manufacturing Technology, Institute of Electrical and Electronics Engineers, 2014, 4, pp.1624-1633. ⟨10.1109/TCPMT.2014.2345100⟩. ⟨hal-01072079⟩

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