@article{cognard:hal-00905269,
  TITLE = {{On modelling the behaviour of a ductile adhesive under low temperatures}},
  AUTHOR = {Cognard, Jean-Yves and Badulescu, Claudiu and Maurice, Julien and Cr{\'e}ac'Hcadec, Romain and Carrere, Nicolas and V{\'e}drine, Pierre},
  URL = {https://hal.science/hal-00905269},
  NOTE = {WOS},
  JOURNAL = {{International Journal of Adhesion and Adhesives}},
  PUBLISHER = {{Elsevier}},
  VOLUME = {47},
  PAGES = {46-56},
  YEAR = {2013},
  DOI = {10.1016/j.ijadhadh.2013.09.024},
  KEYWORDS = {Adhesively-bonded joint ; Stress concentration ; Thermo-mechanical loads ; Finite element analysis ; Joint design},
  HAL_ID = {hal-00905269},
  HAL_VERSION = {v1},
}