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Article Dans Une Revue International Journal of Adhesion and Adhesives Année : 2013

On modelling the behaviour of a ductile adhesive under low temperatures

Jean-Yves Cognard
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MMA
Claudiu Badulescu
MMA
Romain Créac'Hcadec
MMA
Nicolas Carrere
MMA
Pierre Védrine

Résumé

The objective of the paper is to propose a strategy in order to develop accurate numerical models to describe the behaviour of a ductile adhesive in an assembly under mechanical proportional monotonic loads at different low temperatures. This study requires the use of precise 3D numerical analysis of the stress state within a bonded assembly in order to develop an inverse identification technique starting from the load-displacement curves obtained using a modified Arcan apparatus. First, the influence of the geometry of the bonded assembly close to the free edges of the adhesive on the stress state under a mechanical load at a given temperature is analysed with a 2D numerical analysis. These results allow us to propose some rules in order to define accurate experimental devices for such thermo-mechanical loads. The second part is associated with the estimation of the residual stresses within an adhesive in an assembly and the identification of the material parameters of a 3D elastic-plastic Mahnken-Schlimmer type model, for tensile/compression-shear proportional monotonic mechanical loads and for a temperature range between 20 °C and -60 °C.

Dates et versions

hal-00905269 , version 1 (18-11-2013)

Identifiants

Citer

Jean-Yves Cognard, Claudiu Badulescu, Julien Maurice, Romain Créac'Hcadec, Nicolas Carrere, et al.. On modelling the behaviour of a ductile adhesive under low temperatures. International Journal of Adhesion and Adhesives, 2013, 47, pp.46-56. ⟨10.1016/j.ijadhadh.2013.09.024⟩. ⟨hal-00905269⟩
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