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On the effect of the curing cycle on the creation of pores in structural adhesive joints by means of X-ray microtomography

Abstract : Adhesive bonding is increasingly used in numerous industrial branches (aeronautics, space, etc.) for the many advantages this technique features. The quality of the adhesive bonds depends on diversified factors, and bonding defects within the joints are common. These defects may take the shape of pores, of various sizes, which are a possible threat to the good mechanical strength of the joints. These pores may create unwanted stress concentrations, and they are susceptible to locally weaken the adhesive joints. As they are created during the bonding process, the hypothesis that the bonding and curing conditions should influence their properties is well-founded. In order to validate this assertion, adhesively bonded samples were made, for different adhesives and different curing cycles. In particular, the influence of the peak temperature reached during the curing cycle was studied. The pores in the joints were then observed and studied using X-ray microtomography. The performances of the segmentation technique developed for the data processing were studied beforehand on synthetic data, in order to identify the limitations of the suggested methodology and to quantify the uncertainty on the computed quantities. It was found that a higher curing temperature may induce noticeable pore growth phenomena (mainly dilation and coalescence). In particular, this growth seems to be predominant halfway-through the thickness of the joints, resulting in an observable decrease in the effective section.
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Submitted on : Thursday, March 26, 2020 - 1:50:33 PM
Last modification on : Wednesday, July 8, 2020 - 12:42:46 PM



Vincent Dumont, Claudiu Badulescu, Georgios Stamoulis, Jérôme Adrien, E. Maire, et al.. On the effect of the curing cycle on the creation of pores in structural adhesive joints by means of X-ray microtomography. Journal of Adhesion, In press, ⟨10.1080/00218464.2020.1728257⟩. ⟨hal-02520053⟩



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