Skip to Main content Skip to Navigation
Journal articles

FE simulation of the curing behavior of the epoxy adhesive Hysol EA-9321

Abstract : Cold-curing adhesives, characterized by an unsteady curing degree, present various advantages for assembling large scale structures set up under outdoor conditions. Thus various applications can be found in aerospace and automotive industries where structures are affected by thermal and mechanical loads. Hence, the curing state of the adhesive must be known to evaluate the lifetime of such bonded structures. The evolution of the polymerization of the adhesive Hysol EA-9321 during the curing process was examined in this paper. To that end, the curing degree of the adhesive was experimentally and analytically investigated for different curing cycles with a view to a potential application in the aerospace domain, where structures are assembled at low temperatures. Existing dynamic and isothermal curing models were applied to simulate the curing behavior of the adhesive. Then, an FEM model was developed to simulate the process of adhesive curing by taking into account a thermo-kinetic coupling.
Document type :
Journal articles
Complete list of metadata

https://hal.archives-ouvertes.fr/hal-01213235
Contributor : Nathalie Leal <>
Submitted on : Thursday, October 8, 2015 - 10:08:57 AM
Last modification on : Tuesday, December 15, 2020 - 11:20:56 AM

Identifiers

Citation

Ophélie Devaux, Creac'Hcadec Romain, Jean-Yves Cognard, Kévin Mathis, Florian Lavelle. FE simulation of the curing behavior of the epoxy adhesive Hysol EA-9321. International Journal of Adhesion and Adhesives, Elsevier, 2015, 60, pp.31-46. ⟨10.1016/j.ijadhadh.2015.03.005⟩. ⟨hal-01213235⟩

Share

Metrics

Record views

564